PCB design and packaging method analysis of MOEMS devices

MOEMS is an emerging technology that has become one of the most popular technologies in the world. MOEMS is a micro-electro-mechanical system (MEMS) that uses a photonic system. It contains micro-mechanical optical modulators, micro-mechanical optical switches, ICs and other components, and uses the miniaturization, multiplicity, and microelectronics of MEMS technology to achieve Seamless integration of optical devices and electrical devices. Simply put, MOEMS is the further integration of system-level chips. Compared with large-scale opto-mechanical devices, PCB design MOEMS devices are smaller, lighter, faster (with higher resonance frequency), and can be produced in batches. Compared with the waveguide method, this free space method has the advantages of lower coupling loss and smaller crosstalk. The changes in photonics and information technology have directly promoted the development of MOEMS. Figure 1 shows the relationship between microelectronics, micromechanics, optoelectronics, fiber optics, MEMS and MOEMS. Nowadays, information technology is developing rapidly and constantly updated, and by 2010, the speed of light opening can reach Tb/s. Increasing data rates and higher-performance new-generation equipment requirements have driven the demand for MOEMS and optical interconnects, and the application of PCB design MOEMS devices in the field of optoelectronics continues to grow.

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PCB design and packaging method analysis of MOEMS devices

PCB design MOEMS devices and technology PCB design MOEMS devices are divided into interference, diffraction, transmission, and reflection types according to their physical working principles (see Table 1), and most of them use reflective devices. MOEMS has achieved significant development in the past few years. In recent years, due to the increase in demand for high-speed communication and data transmission, the research and development of MOEMS technology and its devices have been greatly stimulated. The required low loss, low EMV sensitivity, and low crosstalk high data rate reflected light PCB design MOEMS devices have been developed.

Nowadays, in addition to simple devices such as variable optical attenuators (VOA), MOEMS technology can also be used to produce tunable vertical cavity surface emitting lasers (VCSEL), optical modulators, tunable wavelength selective photodetectors and other optical devices. Active components and filters, optical switches, programmable wavelength optical add/drop multiplexers (OADM) and other optical passive components and large-scale optical cross-connects (OXC).

In information technology, one of the keys to optical applications is commercialized light sources. In addition to monolithic light sources (such as thermal radiation sources, LEDs, LDs, and VCSELs), MOEMS light sources with active devices are particularly concerned. For example, in a tunable VCSEL, the emission wavelength of the resonator can be changed by changing the length of the resonator by micromechanics, thereby realizing high-performance WDM technology. At present, a support cantilever tuning method and a movable structure with a support arm have been developed.

MOEMS optical switches with movable mirrors and mirror arrays have also been developed for assembling OXC, paralleling, and on/off switch arrays. Figure 2 shows a free-space MOEMS fiber optic switch, which has a pair of U-shaped cantilever actuators for lateral movement of the fiber. Compared with the traditional waveguide switch, its advantages are lower coupling loss and smaller crosstalk.

An optical filter with a wide range of continuously adjustable is a very important device in a variable DWDM network, and MOEMS F_P filters using various material systems have been developed. Due to the mechanical flexibility of the tunable diaphragm and effective optical cavity length, the wavelength tunable range of these devices is only 70nm. Japan’s OpNext company has developed a MOEMS F_P filter with a record tunable width. The filter is based on multiple InP/air gap MOEMS technology. The vertical structure is composed of 6 layers of suspended InP diaphragms. The film is a circular structure and is supported by three or four suspension frames. Rectangular support table connection. Its continuous tunable F_P filter has a very wide stop band, covering the second and third optical communication windows (1 250 ~ 1800 nm), its wavelength tuning width is greater than 112 nm, and the actuation voltage is as low as 5V.

MOEMS design and production technology Most MOEMS production technology is directly evolved from the IC industry and its manufacturing standards. Therefore, body and surface micro-machining and high-volume micro-machining (HARM) technology are used in MOEMS. But there are other challenges such as die size, material uniformity, three-dimensional technology, surface topography and final processing, unevenness and temperature sensitivity.